Ontology Architecture & Build Roadmap
Semiconductor Supply Chain Digital Twin — Ontology Architecture & Build Roadmap
Prepared for co-founder planning session — March 2026
- 28 entity types
- 25 relationship types
- 5 entity groups
- 4 build phases
1. Entity Types (Nodes)
28 distinct node types organized into five semantic groups:
Supply Chain Actors:
- Company (fabless, foundry, IDM, OSAT, EDA vendor, equipment maker, materials supplier, distributor, broker, OEM, EMS/ODM, defense prime)
- Facility (wafer fab, packaging/test plant, warehouse, distribution center, R&D lab, design center)
- Technology (design IP block, EDA software tool, process technology node, reticle set)
Products & Materials:
- Product (chip/die, wafer, equipment, raw material, software module, packaged component)
- Material (silicon wafer, specialty gas, photoresist, substrate, rare earth element, chemical precursor)
- ECCN Classification (export control classification number, CCL category, dual-use flag)
Regulatory & Legal:
- Regulation (UFLPA, EAR, ITAR, CHIPS Act, CFIUS, EU Battery Passport, Section 232)
- Regulatory List (BIS Entity List, OFAC SDN, UFLPA Entity List, BIS Denied Persons)
- Jurisdiction, License/Auth, Compliance Event, Mandatory Filing
Commercial & Financial:
- Supply Agreement, Shipment, Capacity Reservation, Transaction, Price Signal
People & Intelligence:
- Person, Ownership Structure, Risk Event, Simulation Scenario, Alert, Financial Instrument
Build Phases
Phase 1: Core graph (5 anchor firms, facilities, products, regulations, restricted party lists)
Phase 2: Expand to 50+ companies, add supply relationships and shipment data
Phase 3: Add financial layer (price signals, capacity reservations, transactions)
Phase 4: Real-time ingestion, alerting, simulation scenarios
Full 16K char document in local file: Signal/BlissPerry/media/TBD_Ontology_Planning.md