EE 292P: Atoms, Bits, and National Interest (Jan 6)
Attendees: Dustin J Ross Date: January 6, 2026 Type: Class Session
Summary
Course Overview: EE 292P - Atoms, Bits, and National Interest
- 13-week course combining semiconductor technology with policy implications
- Teaching team: Professor Ali, Professor Shravanti Chowdhury (EE), Tom Lee (circuit design), Joe Mata (VC/computer scientist)
- Guest lecturer: Steve Blank (entrepreneurship, national security policy)
- Format: lectures, invited talks, panel discussions (110-minute sessions)
- Structure: Start with semiconductors/materials → build up to computing → applications → economy/society/law → globalization/competition
The Perfect Storm in Semiconductors
- Moore’s Law significantly slowed - only handful of companies (TSMC, Intel, Samsung) can innovate at leading edge
- Dennard scaling ended - voltage scaling no longer viable
- Von Neumann architecture limitations - memory/processor separation creates energy-intensive data movement
- Most chips now power-limited rather than technology-limited
- Solution focus: Efficiency metrics (performance per watt, operations per watt)
AI Compute Explosion and Sustainability Crisis
- Training compute doubling every 3-4 months (vs Moore’s Law 2-year cycle)
- GPT-4 training: ~50,000 megawatt hours
- Claude 4: Even higher compute requirements
- Exponential compute growth could surpass US GDP if trends continue
- Economic unsustainability: Training costs reaching $100M+ per model
Innovation and Economic Impact
- 92% of US GDP growth (first half 2025) came from information processing and software
- Debate: Economic growth measurement challenges in digital age
- Company lifespan in S&P 500: 35+ years (1970s) → 10-12 years (now)
- 40%+ of public companies are venture-funded
- Hardware/software investment ratio shifted dramatically since 2012
Semiconductor Industry Structure (Steve Blank)
- Semiconductor manufacturing most complex in world - atomic-level engineering
- Leading-edge fab cost: $20-30B for 3-5nm, potentially $50B for 2nm
- Single wafer processing: 2,500+ steps, 2-3,000 gallons water per wafer
- 50-year evolution: 3M transistors (4-inch wafer) → 15-30 trillion transistors (12-inch wafer)
- 5 million times increase in transistor density over 50 years
Supply Chain Dependencies and Vulnerabilities
- Five companies globally make chip manufacturing equipment
- ASML (Netherlands): photolithography
- KLA, Lam Research, Applied Materials (US): wafer processing
- Tokyo Electron (Japan): wafer processing
- Materials supply chain highly specialized by country
- Ukraine: neon supply; Israel: RF components; various countries control critical materials
- TSMC: ~2/3 of most advanced chips globally
China-Taiwan Geopolitical Tensions
- “Semiconductors are the oil of the 21st century” - Steve Blank
- China’s largest import: semiconductors (more than oil)
- US 6th largest export: semiconductors
- Taiwan invasion timeline: China aims for “reunification” by 2027 (Communist Party centennial)
- US export controls (October 2022): Blocked semiconductor equipment exports to China
- China building parallel semiconductor ecosystem - currently 1-2 generations behind
US Policy Response: CHIPS Act
- $53B in incentives for domestic fab construction
- Not full funding - matching incentives to offset cost differential vs Taiwan
- TSMC Arizona fabs: ~2% of TSMC total capacity
- Workforce challenges: Skills gap, cultural differences (24/7 fab operations vs work-life balance)
- Missing elements: Insufficient workforce development, compensation incentives
Chinese Semiconductor Strategy
- “Big Fund” national investment program (many executives arrested for fraud by 2022)
- Shanghai Stock Exchange created for semiconductor startups
- More fabs under construction in China than anywhere else
- Developing alternative technologies (synchrotron-based lithography vs EUV)
- National imperative with “gun to their head” - will likely succeed eventually
Technology Innovation Ecosystem
- Fabless model dominance: Apple, Nvidia, AMD design chips, TSMC manufactures
- IP core industry: ARM supplies 40% of chip cores globally
- EDA software duopoly: Synopsys and Cadence control chip design tools
- Packaging evolution: Chiplets enabling performance gains as Moore’s Law slows
- Critical chokepoints throughout supply chain vulnerable to disruption